After emphasizing the reasons of the difference between high-frequency behaviour of electric components from their low-frequency behaviour, new vocabulary and analysis methods followed by new design techniques are presented and applied. In order to cover different circuit components, a basic system of radio transmitter and receiver is considered. Each block in the chain is studied considering its individual functional properties and its interaction with other neighbouring components in the chain, with different constraints to consider and trade-offs to make. The course is divided into 5 chapters: Introduction to RF circuits, Issues in RF design, Amplifiers, Mixers, Oscillators. Seminar: microwave sources. Practical works performed using ADS software.

Integration at the transistor level, Design for Manufacturing, Design of memories. Design of library cells : electrical scheme, simulation, layout, fabrication in clean room.

I. Basic of MEMS fabrication : Reminder of MEMS fabrication, Tutorial on MEMS fabrication II. Inertial MEMS : MEMS accelerometer, Tutorial on MEMS accelerometer, Coventor lab on MEMS accelerometer, MEMS gyroscope, ANSYS tutorial on MEMS gyroscope III. Other MEMS applications : MEMS sensors for environment, MEMS sensors for healthcare, MEMS sensors for biology, MEMS sensors for energy, MEMS sensors for airborne particle contamination

The aim of this course is to discover the possibilities of the semi-conductor technology and to get more insights into its physics and technological development. Targeted applications will be high-frequency technology (in the microwave and millimeter-wave) for the 4G and 5G, optoelectronics for sensing (Infrared, Vision, Imagers), high speed communication (fiber communications, LiFi, Radio-over-Fiber for the 5G), and digital computing for future IA and cyber applications. It will encompasses Silicon and III-V materials, bipolar and CMOS advanced technologies, quantum computing and optoelectronics/photonics technologies. The course will deal both with advanced physics of semiconductors and generic understanding of a technology.

This course provides the audience with knowledge and techniques in building analog circuits for various sensing applications as well as for communication receiver devices. It develops the necessary concepts and continues with circuit design examples, including practical experiments. Circuits as cascode circuit, integrated differential amplifier, Gilbert cell. Practical works are performed using Cadence software.

Design of digital integrated circuits : architecture of digital devices; VHDL, description and simulation of a digital device; Methodology of logic synthesis; Test of digital circuits and design of testable circuits; Programmable circuits as FPGA; Application on FPGA devices. Data acquisition : elementary chain of data acquisition, analog-digital conversion, interface electronics; data flow.

Technologies used to make a digital circuit programmable and related properties. Technologies and properties of memories.

Java language.

Written and spoken english.

The objective is to learn how to design an integrated circuit ensuring a correct transmission of fast signals. Signal integrity deals with problems linked to signal transmission in integrated circuits and several conductors. The EMC (Electromagnetic Compatibility) studies unintentional couplings encountered when two devices work at the same time. These phenomena disturb the transfer of fast signals. The concrete case of a multilayer integrated circuit using a last generation FPGA and DDR3 memories is studied. Signal transmission between the FPGA and the memories is studied using Cadence Allegro and Hyperlynx softwares. The components are represented using Ibis models. Skills: Identifying problems posed by signal integrity. Understanding propagation and cross-talk problems, as well as input-output modeling using Ibis models. Notions of multilayer integrated circuit design.

This course firstly presents the different characteristics of antennas (directivity, gain, radiation efficiency, input impedance...) to permit the choice of an antenna for a targeted application. Then it focuses on the radiation of an elementary dipole and the theoretical calculus of its properties. Finally an introduction of antenna arrays is presented (array factor).

Principles and properties of the different modeling methods in electromagnetism. Study of the FDTD method, the Finite Element Method and the Method of Moment. Practical works using Ansoft Designer (Finite Element Method) and Matlab (Method of Moment).

Seminars given by industrials on leading-edge topics related to the Master training.

Necessary bases for designing optical link of very high throughput, through double skills namely high frequencies in the electrical domain and optics as the transmission support is the optical fiber. Characteristics of key components for this link (laser source, photodetector, different modulators, optical fiber). Possible architectures (direct modulation/direct detection, phase modulation/coherent detection...) and their related advantages. Tools (mathematical formulas) to understand the impact of noise sources and non-linearities of different components on the quality of the opto-microwave link.

Reminders on the characteristics of the main transmission supports (twisted pair, coaxial, optical fiber...). Main relationships deduced from the study of transmission lines (input impedance, SWR, power adaptation devices, reflection...), solving using Smith chart. Characterization of RF devices using S-matrix. Chain matrix for cascading two-port networks. Definition of isolation losses, insertion losses, powers. Example of 3dB-coupler. Transmission through radiated waves. Reminders on the characteristics of the radiated field components and on antennas (gain, directivity, radiation diagram...). Influence on the environment on wave propagation. Applications and examples on link budget.

What is a company (function, status), management styles, different functions of companies, labor law, commercial activity. Study of a practical case.

Internship during 4 to 6 months